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High Temperature Vacuum Cure Ovens

YES-450PB Series

Overview
YES 6-2P-CP Specs (150 mm wafers)
YES 8-2P-CP Specs (200 mm wafers)
YES 12-2P-CP Specs (300 mm wafers)
Process Management Software (option)
Stainless Steel Process Cassettes (accessories)

Applications

Polyimide bake
BCB bake
Copper anneal
Low-K dielectric cure
Copper oxide removal
Aluminum anneal

Critical steps in any cure process include complete removal of residual solvents, uniform temperature distribution, pressure control, ability to maintain dry inert atmosphere, and control of heating and cooling rates. YES ovens achieve this plus particle reduction in most applications.

Chamber Exhaust Condensate Trap

Solvent vapor that evaporates from wafer films during the cure process condenses as soon as the process gas cools. If condensation is not controlled, condensable process effluents can plug vacuum lines, affect control valve operation and degrade the performance of vacuum pumps. YES-PB Series tools use a coalescing condensate trap assembly to control the accumulation and disposal of solvent condensates.

Laminar Flow Technology

YES high temperature vacuum cure ovens offer vertical laminar airflow paired with a unique cooling package to cool the chamber. The vertical laminar flow carries particulates away so they won’t deposit onto wafers. Directing the airflow so it streams from the top of the system and out the bottom ensures there’s no air turbulence, allowing particle reduction in most applications.

Unique Cooling Package

The YES-450PB Series cooling package allows for faster chamber cooling times as well as temperature uniformity control throughout the process. Adjustable air mixing ratio for chamber cooling adapts the tool for best performance over a broad range of operating temperatures. The design allows the process engineer total control of ramp down rates within the tool’s specifications. The cooling package only uses air, no water.

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