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Livermore, CA (PRWEB) August 15, 2014
Yield Engineering Systems, Inc. (YES), a wafer-level packaging equipment manufacturer, announced today that they will be exhibiting at the 11th Annual International Wafer Level Packaging Conference (IWLPC) being held at the Doubletree by Hilton Hotel in San Jose on November 11-12, 2014; YES will be located at Booth #6. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
YES manufactures a wide variety of processing equipment, including flexible tools for Wafer Level Packaging (WLP) type processes which offer increased performance, small footprint, and low-cost of ownership. The YES-VertaCure and the YES-450-PB Series use a high temperature, vacuum cure process for polyimide and BCB cure applications.
Consumers are depending on their mobile electronics to be smaller and faster. Wafer-level packaging is critical to achieve compact packages that fit inside these mobile devices. YES tools assist device manufacturers with achieving a portion of the process through a consistent, repeatable cure of their package.
“We meet customers continuously that have been looking for a solution to their WLP issues,” said Bill Moffat, Founder and CEO of YES. “Our YES-Vertacure offers uniform solvent evaporation and an oxygen-free environment. Companies are realizing the benefits of our polyimide cure process and taking a serious interest. We are attending IWLPC to make sure we reach our intended audience and let them know how our tools can assist them.”
For more information regarding YES ovens, visit http://www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.
About Yield Engineering Systems, Inc.
YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, WLP, FPD, MEMS, medical, nanotech industries and more. They manufacture high temperature vacuum cure ovens, silane vapor phase deposition systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.