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Livermore, CA (PRWEB) October 7, 2015
Yield Engineering Systems, Inc. (YES) announced today that their Chief Executive Officer, Bill Moffat, will be a speaker during the AVS 62nd International Symposium & Exhibition at the San Jose Convention Center. Moffat’s presentation on “Variations on Vacuum Baking for MEMS Processing” will take place on Wednesday, October 21, 2015 at 2 pm. Participants will delve into the discussion of current wafer-level packaging and MEMS solutions. Yield Engineering Systems will also have a booth at the show to answer any processing questions. YES will be located at booth #333.
YES manufactures a wide variety of processing equipment including tools to assist MEMS device manufacturers with proper curing, surface tension modification, getter activation, metal annealing and wafer dehydration. The AVS 62nd International Symposium and Exhibition will address cutting-edge issues associated with materials, processing, and interfaces in the research and manufacturing communities. More than 2,000 scientists and engineers gather from around the world to attend. To register and for more information, visit http://www.avs.org/symposium.
Bill Moffat, Founder and CEO of YES said, “I hope to engage and connect with the conference attendees that are searching for a solution to their WLP and MEMS device issues. The benefits I will discuss regarding silane vapor phase deposition, high vacuum and polyimide cure are critical processes for the success of WLP/MEMS.”
For more information regarding YES ovens, visit http://www.yieldengineering.com" or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.
About Yield Engineering Systems, Inc.
YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, WLP, FPD, MEMS, medical industries and more.
They manufacture high temperature vacuum cure ovens, silane vapor phase deposition systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.