Overview

The YES-VertaCure automated, high temperature vacuum cure series of ovens is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution Layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.

The production proven platform incorporates the laminar flow technology for low particle performance using the technology of the YES-PB series. It accommodates 200 and 300mm wafers with two or four load ports and a wafer handling robot inside an integrated Class 1 mini-environment. Up to 100 wafers are loaded into a stainless steel cassette-type rack on the oven chamber door and, when loading is complete, lifted up into the vacuum chamber.

The system can accommodate a variety of processes needed to successfully cure a variety of materials, such as:

  • Polyimides
  • PBO (Polybenzoxazoles)
  • BCB (Benzocyclobutene – Cyclotene)
  • Epoxy “hybrids”

System Benefits

The YES Vacuum cure process offers 5x less outgassing than atmospheric cure processes, which allows:

  • Excellent electrical and thermal performance
  • Excellent high temperature warpage performance
  • No outgassing
  • Reduction in the number of particles
  • Shorter process time
  • Less Nitrogen used
  • No trapped solvent
  • Excellent temperature uniformity
  • Fast ROI

 The oven is ideal for your Fan-Out Wafer Level Packaging needs.  Read more about FOWLP here.

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News & Updates

  • October 23-24, 2018 - Visit YES at Booth #7 at the International Wafer Level Packaging Conference at the San Jose Doubletree Hotel.
  • October 1-3, 2018 - Visit YES at Booth # 8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA).
  • August 31, 2018 - YES Signs Scientech Corporation as New Sales Rep for China, Taiwan and SE Asia Read more »
  • July 10-12, 2018 - Visit YES at SEMICON West in South Hall Booth #810 in San Francisco, CA
  • May 29-31, 2018 - Visit YES at Booth #202 at ECTC in San Diego, CA.
  • May 7-9, 2018 - Visit YES at Booth #100 at CSManTech in Austin, Texas.
  • October 23, 2017- YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP. Read more »
  • June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
    Read more »
  • May 5, 2017 - YES CEO to Participate as a Panelist
    Read more »
  • January 20, 2017 - YES Highlighted in Online Commentary
    Read more »
  • September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
    Read more »
  • August 9, 2016 - YES Featured in Two Trade Magazines
    Read more »

Other Updates

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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.