Overview

The YES-VertaCure automated, high temperature cure series of ovens is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution Layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.

The system incorporates the laminar flow technology of the YES-PB series. It accommodates 200 and 300mm wafers with two or four load ports and a wafer handling robot inside an integrated Class 1 mini-environment. Up to 100 wafers are loaded into a stainless steel cassette-type rack on the oven chamber door and, when loading is complete, lifted up into the vacuum chamber.

The system can accommodate a variety of processes needed to successfully cure a variety of materials, such as:

  • Polyimides
  • PBO (Polybenzoxazoles)
  • BCB (Benzocyclobutene – Cyclotene)
  • Epoxy “hybrids”

System Benefits

  • Excellent electrical and thermal performance
  • Excellent high temperature warpage performance
  • Improved board-level reliability
  • Reduction in the number of particles
  • Shorter process time
  • Less Nitrogen used
  • No discoloration
  • No trapped solvent
  • Increase in Known Good Die
  • Excellent temperature uniformity
  • Fast ROI

The oven is ideal for your Fan-Out Wafer Level Packaging needs.  Read more about FOWLP here.

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News & Updates

  • October 1-3, 2018 - Visit YES at Booth # 8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA).
  • August 31, 2018 - YES Signs Scientech Corporation as New Sales Rep for China, Taiwan and SE Asia Read more »
  • July 10-12, 2018 - Visit YES at SEMICON West in South Hall Booth #810 in San Francisco, CA
  • May 29-31, 2018 - Visit YES at Booth #202 at ECTC in San Diego, CA.
  • May 7-9, 2018 - Visit YES at Booth #100 at CSManTech in Austin, Texas.
  • October 23, 2017- YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP. Read more »
  • June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
    Read more »
  • May 5, 2017 - YES CEO to Participate as a Panelist
    Read more »
  • January 20, 2017 - YES Highlighted in Online Commentary
    Read more »
  • September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
    Read more »
  • August 9, 2016 - YES Featured in Two Trade Magazines
    Read more »

Other Updates

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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.