The YES-VertaCure automated, high temperature vacuum cure series of ovens is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution Layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.

The production proven platform incorporates the laminar flow technology for low particle performance using the technology of the YES-PB series. It accommodates 200 and 300mm wafers with two or four load ports and a wafer handling robot inside an integrated Class 1 mini-environment. Up to 100 wafers are loaded into a stainless steel cassette-type rack on the oven chamber door and, when loading is complete, lifted up into the vacuum chamber.

The system can accommodate a variety of processes needed to successfully cure a variety of materials, such as:

  • Polyimides
  • PBO (Polybenzoxazoles)
  • BCB (Benzocyclobutene – Cyclotene)
  • Epoxy “hybrids”

System Benefits

The YES Vacuum cure process offers 5x less outgassing than atmospheric cure processes, which allows:

  • Excellent electrical and thermal performance
  • Excellent high temperature warpage performance
  • No outgassing
  • Reduction in the number of particles
  • Shorter process time
  • Less Nitrogen used
  • No trapped solvent
  • Excellent temperature uniformity
  • Fast ROI

 The oven is ideal for your Fan-Out Wafer Level Packaging needs.  Read more about FOWLP here.

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News & Updates

  • Medical Device Industry White Paper (pdf)
  • Genomics White Paper (pdf)
  • October 22-23, 2019 - Visit YES at Booth #39 at the International Wafer Level Packaging Conference at the San Jose Doubletree Hotel
  • October 7-9, 2019 - Visit YES at Booth #8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA)
  • July 9-11, 2019 - Visit YES at booth #932 at Semicon West in San Francisco
  • June 25-27, 2019 - Visit YES at booth #244 at Sensors Expo and Conference in San Jose
  • May 28-31, 2019 - Visit YES at booth #219 at ECTC in Las Vegas
  • April 29-May 2, 2019 - Visit YES at booth #306 at CS Mantech in Minneapolis
  • March 4-7, 2019 - Visit YES at Booth #64 at the IMAPS Device Packaging Conference in Arizona

Other Updates


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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.