Process Management Software (option)

The YES-VertaCure automated, high temperature cure series of ovens is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution Layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.

The system incorporates the laminar flow technology of the YES-PB series. It accommodates 200 and 300mm wafers with one or two load ports and a wafer handling robot inside an integrated Class 1 mini-environment. Up to 50 wafers are loaded into a stainless steel cassette-type rack on the oven chamber door and, when loading is complete, lifted up into the vacuum chamber.


Chamber Exhaust Condensate Trap

Solvent vapor that evaporates from wafer films during the cure process condenses as soon as the process gas cools. If condensation is not controlled, condensable process effluents can plug vacuum lines, affect control valve operation and degrade the performance of vacuum pumps. YES-VertaCure Series tools use a coalescing condensate trap assembly to control the accumulation and disposal of solvent condensates.  (Actual specifications of drawing may vary.)

Unique Cooling Package YES Oven Cooling Airflow

The YES-VertaCure Series cooling package allows for faster chamber cooling times as well as temperature uniformity control throughout the process. Adjustable air mixing ratio for chamber cooling adapts the tool for best performance over a broad range of operating temperatures. The design allows the process engineer total control of ramp down rates within the tool's specifications.

Exhaust Diffuser Assembly (optional)

The YES-VertaCure Series Exhaust Diffuser Assembly, when supplied with facilities cooling water, reduces facilities air-conditioning requirements by lowering the temperature of the chamber cooling air exhaust. In most cases, additional facilities ventilation is not needed. The airflow in the Exhaust Diffuser Assembly is modulated with temperature control feedback.

YES-VertaCure is designed to achieve tight control over your process conditions:

  • Uniform solvent evaporation with laminar flow and reduced process pressures
  • Efficient evolving of solvents from the film allows better control of imidization rates
  • Controlled temperature ramp up and cool down
  • Extremely low oxygen process concentrations due to a dry inert ambient
  • Horizontal laminar flow for increased particle isolation and removal (for most cure processes, average particle addition is calculated to be < 0)
  • A touch screen interface enables the process be fully automated

The YES-VertaCure provides the process conditions required for proper curing of the polyimide layer. Read full WLP white paper here.

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News & Updates

  • March 4-7, 2019 - Visit YES at Booth #64 at the IMAPS Device Packaging Conference in Arizona
  • December 20, 2018 - YES Announces Initial Shipments of YES- ÉcoClean Photoresist Strip/Descum System Read more »
  • October 23-24, 2018 - Visit YES at Booth #7 at the International Wafer Level Packaging Conference at the San Jose Doubletree Hotel.
  • October 1-3, 2018 - Visit YES at Booth # 8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA).
  • August 31, 2018 - YES Signs Scientech Corporation as New Sales Rep for China, Taiwan and SE Asia Read more »
  • July 10-12, 2018 - Visit YES at SEMICON West in South Hall Booth #810 in San Francisco, CA
  • May 29-31, 2018 - Visit YES at Booth #202 at ECTC in San Diego, CA.
  • May 7-9, 2018 - Visit YES at Booth #100 at CSManTech in Austin, Texas.
  • October 23, 2017- YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP. Read more »
  • June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
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  • May 5, 2017 - YES CEO to Participate as a Panelist
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  • January 20, 2017 - YES Highlighted in Online Commentary
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  • September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
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  • August 9, 2016 - YES Featured in Two Trade Magazines
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Other Updates


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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.

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