Wafer Level Packaging Equipment Manufacturer Yield Engineering

Wafer-level Packaging Equipment Manufacturer, Yield Engineering Systems, Inc. (YES), Releases New Whitepaper

“Superior Polymer Processing for Wafer-level Packaging” discusses the importance of RDL.

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Livermore, CA (PRWEB) December 19, 2012

Yield Engineering Systems, Inc. (YES), a wafer-level packaging (WLP) process equipment manufacturer, announced today that they have written a new whitepaper discussing the importance of using a polyimide vacuum curing system instead of an atmospheric oven for successful Redistribution Layers (RDL). It was recently featured on Semiconductor Packaging News. The full whitepaper can be obtained online at http://www.yieldengineering.com/wlp.

“Superior Polymer Processing for Wafer-level Packaging” explains that an integral part of WLP involves the relocation of the Input/Output (I/O) pads used to communicate with the die to points suitable for the final package. The pads can be relocated using RDL.

YES manufactures a variety of equipment including tools for WLP type processes with a low-cost of ownership. The YES-VertaCure Series and the YES-450PB Series use high temperature to achieve wafer dehydration, oxygen removal and solvent outgassing. These processes are vital to the success of wafer-level packaging.

“YES equipment significantly streamlines the WLP process,” says Bill Moffat, CEO and Founder, “We understand engineer’s WLP issues and have created a viable solution.”

For more information regarding the YES-VertaCure or YES-450PB, visit http://www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.

About Yield Engineering Systems, Inc.

YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, WLP, photovoltaic, FPD, MEMS, medical, nanotech industries and more.

They manufacture high temperature vacuum cure ovens, chemical vapor deposition (CVD) systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.


News & Updates

  • July 9-11, 2019 - Visit YES at booth #932 at Semicon West in San Francisco
  • June 25-27, 2019 - Visit YES at booth #244 at Sensors Expo and Conference in San Jose
  • May 28-31, 2019 - Visit YES at booth #219 at ECTC in Las Vegas
  • April 29-May 2, 2019 - Visit YES at booth #306 at CS Mantech in Minneapolis
  • March 4-7, 2019 - Visit YES at Booth #64 at the IMAPS Device Packaging Conference in Arizona
  • December 20, 2018 - YES Announces Initial Shipments of YES- ÉcoClean Photoresist Strip/Descum System Read more »
  • October 23-24, 2018 - Visit YES at Booth #7 at the International Wafer Level Packaging Conference at the San Jose Doubletree Hotel.
  • October 1-3, 2018 - Visit YES at Booth # 8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA).
  • August 31, 2018 - YES Signs Scientech Corporation as New Sales Rep for China, Taiwan and SE Asia Read more »
  • July 10-12, 2018 - Visit YES at SEMICON West in South Hall Booth #810 in San Francisco, CA
  • May 29-31, 2018 - Visit YES at Booth #202 at ECTC in San Diego, CA.
  • May 7-9, 2018 - Visit YES at Booth #100 at CSManTech in Austin, Texas.

Other Updates


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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.

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