Semiconductor Packaging News - VIEWPOINT 2019, Ken MacWilliams, CEO

Semiconductor Packaging News - VIEWPOINT 2019: Ken MacWilliams, CEO, Yield Engineering Systems, Inc.

Livermore, CA (Semiconductor Packaging News) January 23, 2019

VIEWPOINT 2019: Ken MacWilliams, CEO, Yield Engineering Systems, Inc.
With new management and an enhanced advisory board in place, we at Yield Engineering Systems Inc. (YES) are very excited about continuing our high growth into 2019. YES supplies the emerging and high-growth market segments beyond FE semi with the high technology they require, though at a quantum reduction in price and cost of ownership: a unique value proposition!

Although our present product portfolio addresses these needs well, we are particularly enthusiastic about our new systems and recent improvements we have made to existing systems. These products will further enable our customers with the required cost-effective technology solutions to create and volume-produce their next-generation products.

YES's seamless lab-to-fab "coat, clean and cure" solutions are empowering our customers to create breakthrough technology in a wide range of markets, including Advanced Packaging, MEMS, Artificial Intelligence and Life Sciences. It has been gratifying to watch our innovative YES-ÉcoClean gaining traction in MEMS, power devices, and communication/RF, where it is providing high reliability with a very low cost of ownership and a frugal footprint. This environmentally friendly plasma cleaning system's photoresist removal and descum capabilities have been welcomed worldwide by 200mm fabs, which continue to ramp faster than 300mm fabs.

We are also pleased to see how well our series of coating systems, with the ability to apply uniform monolayers, is meeting the needs of emerging biotech sector. Users ranging from cutting-edge research labs to high-volume manufacturers are finding YES products valuable in their genome sequencing and gene editing ("reading" and "writing") efforts.

We look forward to further growth for these products in anti-stiction applications for MEMS, as well as in several packaging and SAM (Self Assembled Materials) applications. In addition, we expect that our sub-atmospheric cure products, including the YES-VertaCure, will continue to support innovation worldwide.

When the future asks for surface modification...YES is the answer!

Ken MacWilliams, CEO
Yield Engineering Systems, Inc.



News & Updates

  • Genomics White Paper (pdf)
  • October 22-23, 2019 - Visit YES at Booth #39 at the International Wafer Level Packaging Conference at the San Jose Doubletree Hotel
  • October 7-9, 2019 - Visit YES at Booth #8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA)
  • July 9-11, 2019 - Visit YES at booth #932 at Semicon West in San Francisco
  • June 25-27, 2019 - Visit YES at booth #244 at Sensors Expo and Conference in San Jose
  • May 28-31, 2019 - Visit YES at booth #219 at ECTC in Las Vegas
  • April 29-May 2, 2019 - Visit YES at booth #306 at CS Mantech in Minneapolis
  • March 4-7, 2019 - Visit YES at Booth #64 at the IMAPS Device Packaging Conference in Arizona

Other Updates


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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.