Fan-Out Wafer-Level Packaging Equipment Manufacturer

Fan-Out Wafer-Level Packaging Equipment Manufacturer, Yield Engineering Systems, Inc. (YES), Highlighted in Online Commentary

YES Founder and CEO, Bill Moffat, discusses his “Viewpoint” in Semiconductor Packaging News

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Livermore, CA (PRWEB) January 20, 2017

YES’ Founder and CEO, Bill Moffat, discusses his insights on the 2017 outlook of the semiconductor industry. The “Viewpoint” feature is published annually by Semiconductor Packaging News and seeks out industry professionals from around the world. Read the feature in its entirety here.

With global markets forecasting growth in 2017, Moffat is optimistic about semiconductor growth. He discusses the expansion of the YES-PB Series dielectric vacuum cure ovens used for the Fan-Out Wafer-Level Packaging (FOWLP) market. The ovens offer a vacuum thermal cure that is a critical step for FOWLP and offers:

  • Gentle vacuum process
  • Reduction in particles
  • Shorter process time
  • Less Nitrogen used
  • No discoloration
  • No trapped solvent
  • Increase in Known Good Die

Moffat also introduced a new single wafer 200mm Plasma Strip System that strips tough layers of polyimide and photoresist in the shortest amount of production time. “The new system will hit the market in mid-2017,” said Moffat, “The tool was created especially for the MEMS industry and is aimed at the one wafer per minute strip market at a reasonable price.”

For more information regarding YES tools, visit www.yieldengineering.com or contact them toll free in the USA or Canada at 888-937-3637 or worldwide at +1-925-373-8353.

About Yield Engineering Systems, Inc.

YES was founded in 1980, and is headquartered in Livermore, California, USA. They provide quality process equipment for semiconductor, photovoltaic, WLP, FOWLP, MEMS, medical, nanotech industries and more.

They manufacture dielectric vacuum cure ovens, silane vapor phase deposition systems, plasma etch and clean tools used for precise surface modification, surface cleaning, and thin film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical slides.

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News & Updates

  • October 23-24, 2018 - Visit YES at Booth #7 at the International Wafer Level Packaging Conference at the San Jose Doubletree Hotel.
  • October 1-3, 2018 - Visit YES at Booth # 8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA).
  • August 31, 2018 - YES Signs Scientech Corporation as New Sales Rep for China, Taiwan and SE Asia Read more »
  • July 10-12, 2018 - Visit YES at SEMICON West in South Hall Booth #810 in San Francisco, CA
  • May 29-31, 2018 - Visit YES at Booth #202 at ECTC in San Diego, CA.
  • May 7-9, 2018 - Visit YES at Booth #100 at CSManTech in Austin, Texas.
  • October 23, 2017- YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP. Read more »
  • June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
    Read more »
  • May 5, 2017 - YES CEO to Participate as a Panelist
    Read more »
  • January 20, 2017 - YES Highlighted in Online Commentary
    Read more »
  • September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
    Read more »
  • August 9, 2016 - YES Featured in Two Trade Magazines
    Read more »

Other Updates

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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.