Benzocyclobutene (BCB) is used to create photosensitive polymers, which require fewer processing steps than dry etch materials.
Annealing is a heat treatment where the microstructure of a material is altered, causing changes in its properties such as strength and hardness.
Vacuum bake at high temperature to ensure elimination of surface moisture.
Fan-out wafer level packaging (FOWLP) uses mold compound to embed various functional dies.
Fan Out Wafer Level Packaging
Complete dehydration of porous low-K material poses a major challenge to process engineers.
Polyimides are high temperature engineering polymers utilized by semiconductor manufacturers for their excellent mechanical, thermal, and electrical properties.
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