Wirebond Preparation

Wirebond PreparationAfter hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy. But this process causes small amounts of contamination on top of the bond pads that can inhibit wire bonding. Therefore, treating the surface to remove contaminants improves the wire bond.

YES plasma cleaning systems such as the YES-G500 & G1000 are ideally suited for wire bond surface preparation.

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