Wirebond Preparation

Wirebond PreparationAfter hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy. But this process causes small amounts of contamination on top of the bond pads that can inhibit wire bonding. Therefore, treating the surface to remove contaminants improves the wire bond.

YES plasma cleaning systems such as the YES-G500 & G1000 are ideally suited for wire bond surface preparation.

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Tradeshows

  • February 11-13, 2020 - Visit YES at booth #904 at Medical Design & Manufacturing (MD&M) West, Anaheim, CA
  • May 26-29, 2020 - Visit YES at booth #208 at ECTC 2020, Orlando, FL
  • July 21-23, 2020 - Visit YES at Booth #5969 at SEMICON West 2020, in San Francisco, CA

About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.

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