Resist Strip

In wafer fabrication, photoresist is used to transfer a circuit pattern onto the wafer.

Resist Strip

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Resist Descum

Removing residues (scum) from a substrate through gentle plasma cleaning is known as descumming.

Resist Descum

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Organics Removal

Oxygen plasma etching is an effective treatment for “burning off”, or bombarding, organic residues left on wafer surfaces due to resist cross-linking or polymerization.

Organics Removal

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Wirebond Preparation

After hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy.

Wirebond Preparation

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Plasma Cleaning

The use of plasma is an effective way to clean without using hazardous solvents. Plasma is an ionized gas capable of conducting electricity and absorbing energy from an electrical supply.

Plasma Cleaning

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Please call 1-925-373-8353 or 1-888-YES-3637 (US toll free). Or you can submit an inquiry online, contact us.

• Genomics White Paper (pdf)
• October 22-23, 2019 - Visit YES at Booth #39 at the International Wafer Level Packaging Conference at the San Jose Doubletree Hotel
• October 7-9, 2019 - Visit YES at Booth #8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA)
• July 9-11, 2019 - Visit YES at booth #932 at Semicon West in San Francisco
• June 25-27, 2019 - Visit YES at booth #244 at Sensors Expo and Conference in San Jose
• May 28-31, 2019 - Visit YES at booth #219 at ECTC in Las Vegas
• April 29-May 2, 2019 - Visit YES at booth #306 at CS Mantech in Minneapolis
• March 4-7, 2019 - Visit YES at Booth #64 at the IMAPS Device Packaging Conference in Arizona

Other Updates

• See our list of upcoming tradeshows!