Resist Strip

In wafer fabrication, photoresist is used to transfer a circuit pattern onto the wafer.

Resist Strip

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Resist Descum

Removing residues (scum) from a substrate through gentle plasma cleaning is known as descumming.

Resist Descum

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Organics Removal

Oxygen plasma etching is an effective treatment for “burning off”, or bombarding, organic residues left on wafer surfaces due to resist cross-linking or polymerization.

Organics Removal

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Wirebond Preparation

After hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy.

Wirebond Preparation

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Plasma Cleaning

The use of plasma is an effective way to clean without using hazardous solvents. Plasma is an ionized gas capable of conducting electricity and absorbing energy from an electrical supply.

Plasma Cleaning

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Please call 1-925-373-8353 or 1-888-YES-3637 (US toll free). Or you can submit an inquiry online, contact us.

• October 1-3, 2018 - Visit YES at Booth # 8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA).
• July 10-12, 2018 - Visit YES at SEMICON West in South Hall Booth #810 in San Francisco, CA
• May 29-31, 2018 - Visit YES at Booth #202 at ECTC in San Diego, CA.

• May 7-9, 2018 - Visit YES at Booth #100 at CSManTech in Austin, Texas.
• October 23, 2017- YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP. Read more »
• June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
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• May 5, 2017 - YES CEO to Participate as a Panelist
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• January 20, 2017 - YES Highlighted in Online Commentary
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• September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
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• August 9, 2016 - YES Featured in Two Trade Magazines
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Other Updates

• See our list of upcoming tradeshows!