Photoresist Adhesion PromotionYES introduced a process now commonly known in the semiconductor industry as vacuum bake/vapor prime, a key step in the front end processing of silicon chips. The process dramatically improves the application of hexamethyldisilizane (HMDS) as a surface priming treatment, which is used to enhance adhesion of photoresist on a wafer surface.

Early application of HMDS used immersion or spraying of liquid chemical onto the surface of the wafer in a room atmosphere, but wet HMDS application processes have limited surface longevity. Process engineers must apply photoresist within a few hours of HMDS treatment or the surface modification affects of the HMDS are degraded or lost.

Investigation into the limited surface longevity revealed the culprit was water vapor, which is always entrained on surfaces exposed to atmosphere. Effectively, the HMDS was bonding to a microscopic water layer rather than to the wafer surface.

In order to extend the lifespan, first, wafers must be completely dehydrated—not only surface moisture, but chemically bound water molecules as well. To achieve this, Yield Engineering Systems developed a process combining high temperature with low pressure. YES vacuum ovens remove the moisture that is chemically bound to the surface so the silane/substrate bond isn’t impaired.

Then, when chemical is applied, a superior bond is formed that is stable even after exposure to atmospheric moisture. Wafers properly treated will last for weeks with no change to surface adhesion.

The Vacuum Bake/Vapor Prime process offers several process advantages over liquid HMDS application:

  • Chemical Deposition Uniformity
  • Contact Angle Control Within +/- 3 Degrees
  • Moisture Resistant Surface Modification
  • Increased Time Available Between Process Steps
  • Angstrom-Level Thickness Control
  • Reduced Chemical Usage

YES-TA Series vacuum bake/vapor prime ovens are ideally suited for HMDS deposition.

Having a photoresist adhesion issue? Check out our Troubleshooting Photoresist Adhesion Checklist.

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News & Updates

  • October 23-24, 2018 - Visit YES at Booth #7 at the International Wafer Level Packaging Conference at the San Jose Doubletree Hotel.
  • October 1-3, 2018 - Visit YES at Booth # 8 at Lab On a Chip at the Coronado Island Marriott Resort & Spa (San Diego, CA).
  • August 31, 2018 - YES Signs Scientech Corporation as New Sales Rep for China, Taiwan and SE Asia Read more »
  • July 10-12, 2018 - Visit YES at SEMICON West in South Hall Booth #810 in San Francisco, CA
  • May 29-31, 2018 - Visit YES at Booth #202 at ECTC in San Diego, CA.
  • May 7-9, 2018 - Visit YES at Booth #100 at CSManTech in Austin, Texas.
  • October 23, 2017- YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP. Read more »
  • June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
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  • May 5, 2017 - YES CEO to Participate as a Panelist
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  • January 20, 2017 - YES Highlighted in Online Commentary
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  • September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
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  • August 9, 2016 - YES Featured in Two Trade Magazines
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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.

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