INDUSTRIES
MEMS
MEMS
Through years of partnership with MEMS companies, YES understands the challenges of MEMS device manufacturers. YES offers established processes and proven tools to assist the industry with applications needed to be successful. Take a closer look at our YES tools and the MEMS solutions they provide:
Surface Tension Modification – As devices are made smaller, static friction (stiction) becomes more significant. By modifying the surface tension with a class of fluorinated silanes, the operating life of moving parts in MEMS devices can be significantly lengthened. Conversely, if surfaces need to be bonded together, other silanes can be coated which enhance bonding strengths between unlike materials.
- YES – ÉcoCoat
- YES – VertaCoat
- YES – VertaVac
- YES – VertaVac
- YES – ÉcoCoat
- YES – TA Series
- YES – VertaCure
- Improves properties of the copper layer
- Increases grain size for faster polishing
- Provides better conductivity
- Reduces surface tension
- Minimizes electromigration
- Allows a consistent CMP rate across the wafer
- YES – CV200RF
- YES – CV200RFS
- YES-VertaVac Series
- YES-450PB-HV Series
MEMS Industry Challenge
Microelectromechanical Systems (MEMS) typically have moving parts that are sensitive to the operating pressure, the partial pressure of water vapor in the package, or both. For example, infrared sensors need to operate in a pressure <10-3 Torr in order to be thermally isolated from the outside world and maintain adequate sensitivity. MEMS gyros increase in their sensitivity as the pressure in a package decreases. Water vapor can also cause stiction, where device components are “glued” together by thin films of water and unable to function. When creating a high-reliability MEMS package, it is imperative to have complete moisture removal prior to hermetic sealing the package. After packaging, moisture removal is required over the lifetime of the MEMS device. Maintaining a controlled ambient in a packaged MEMS depends on the use of getters that absorb the outgassed species from the packaging materials that would otherwise degrade the vacuum environment. Successful devices and package systems require a good vacuum or a controlled ambient. For optimal performance, the following must occur:- Proper processing to reduce trapped gases in the package
- Hermetically sealing the package
- Providing a means to absorb gases that outgas into the package