Saturday, July 26, 2014
Request Quote

Polyimide Cure Ovens

YES-VertaCure

Overview

VertaCure Specs (200/300mm)

Process Management Software (option)

The YES-VertaCure automated, high temperature cure series of ovens is designed for today’s most advanced MEMS and semiconductor process applications. Whether it’s for proper curing of polyimide in Wafer-level Packaging (WLP)/ Redistribution Layers (RDL) applications or annealing copper in an advanced semiconductor device, the YES-VertaCure helps achieve total environmental control to increase yields and extend device performance.

The system incorporates the laminar flow technology of the YES-PB series. It accommodates 200 and 300mm wafers with one or two load ports and a wafer handling robot inside an integrated Class 1 mini-environment. Up to 50 wafers are loaded into a stainless steel cassette-type rack on the oven chamber door and, when loading is complete, lifted up into the vacuum chamber.

Applications

Chamber Exhaust Condensate Trap

Solvent vapor that evaporates from wafer films during the cure process condenses as soon as the process gas cools. If condensation is not controlled, condensable process effluents can plug vacuum lines, affect control valve operation and degrade the performance of vacuum pumps. YES-VertaCure Series tools use a coalescing condensate trap assembly to control the accumulation and disposal of solvent condensates.  (Actual specifications of drawing may vary.)

Unique Cooling Package YES Oven Cooling Airflow

The YES-VertaCure Series cooling package allows for faster chamber cooling times as well as temperature uniformity control throughout the process. Adjustable air mixing ratio for chamber cooling adapts the tool for best performance over a broad range of operating temperatures. The design allows the process engineer total control of ramp down rates within the tool's specifications.

Exhaust Diffuser Assembly (optional)

The YES-VertaCure Series Exhaust Diffuser Assembly, when supplied with facilities cooling water, reduces facilities air-conditioning requirements by lowering the temperature of the chamber cooling air exhaust. In most cases, additional facilities ventilation is not needed. The airflow in the Exhaust Diffuser Assembly is modulated with temperature control feedback.

YES-VertaCure is designed to achieve tight control over your process conditions:

  • Uniform solvent evaporation with laminar flow and reduced process pressures
  • Efficient evolving of solvents from the film allows better control of imidization rates
  • Controlled temperature ramp up and cool down
  • Extremely low oxygen process concentrations due to a dry inert ambient
  • Horizontal laminar flow for increased particle isolation and removal (for most cure processes, average particle addition is calculated to be < 0)
  • A touch screen interface enables the process be fully automated

The YES-VertaCure provides the process conditions required for proper curing of the polyimide layer. Read full WLP white paper here.

Home   |   About Us   |   Products   |   Applications   |   WLP   |   MEMS   |   News   |   Contact Us
©2014 Copyright Yield Engineering Systems, Inc. | All Rights Reserved