SIO-300-450 (fully automated)
YES-VertaCure (automated wafer handling)
Smartphone, tablet and laptop computer consumers are depending on their electronics to be small, lightweight and fast. Wafer Level Packaging (WLP) allows these products to be handheld sizes with high-quality graphics. Advanced WLP will enable the electronics industry to make the next generation of electronic products be even smaller and more powerful.
The use of Redistribution Layers (RDL) is an integral part of WLP, in which processes are being performed at the wafer level instead of later with wire bonding. An important component of RDL is the multiple polyimide layers incorporated in the Wafer-Level Packaging WLP/RDL circuits. The manufacturability of the polyimide layer depends on the curing process for the polyimide precursors.
A consistent repeatable polyimide curing process is critical in achieving uniform properties and excellent electrical properties. YES ovens provide the process conditions required for proper curing of the polyimide layer.
Read full WLP/RDL whitepaper here.
Fan Out Wafer Level Packaging (FOWLP) uses a wafer reconstruction process, where Known Good Die (KGD) and other types of devices, packages or components are placed side-by-side and embedded with epoxy mold compound. This is followed by a thin-film processing, repassivation and metallization on one or both sides of the wafer to fan out interconnections from original die pads to external pad locations.
The polyimide cure ovens offer a vacuum thermal cure that is a critical step for FOWLP and offers:
Read Integrated Fan-out Technology whitepaper here.