YES-VertaCure (automated wafer handling)
Smartphone, tablet and laptop computer consumers are depending on their electronics to be small, lightweight and fast. Wafer Level Packaging (WLP) allows these products to be handheld sizes with high-quality graphics. Advanced WLP will enable the electronics industry to make the next generation of electronic products be even smaller and more powerful.
The use of Redistribution Layers (RDL) is an integral part of WLP, in which processes are being performed at the wafer level instead of later with wire bonding. An important component of RDL is the multiple polyimide layers incorporated in the Wafer-Level Packaging WLP/RDL circuits. The manufacturability of the polyimide layer depends on the curing process for the polyimide precursors.
A consistent repeatable polyimide curing process is critical in achieving uniform properties and excellent electrical properties. YES ovens provide the process conditions required for proper curing of the polyimide layer.
Read full WLP/RDL whitepaper here.