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Pre-owned
Yield Engineering Systems is now offering pre-owned and factory reconditioned YES tools!
Call 925-373-8353 or inquire within
Three (3) tools are currently for sale:
- YES-CV200RFS (Plasma Photoresist/Descum System) Demo tool {$49,500 - Domestic}
- YES-1224 (Vapor Deposition System) Demo tool {$125,000 - Domestic}
- YES-G1000 (Plasma Cleaning System) Demo tool {$39,500 - Domestic}
- YES-3 (Vacuum Bake/ Vapor Prime System) {SOLD}
YES-CV200RFS (Plasma Photoresist/Descum System):
- Tool Control: PLC control of valves, temperature set points, plasma generation power, auto operation, touch screen interface, self-diagnostic program for easy troubleshooting
- Ethernet for PLC monitoring and software downloads
- 12 Process Recipes with load/save/loop/link capability
- Constant real-time display of System Status
- Audible and Visual Indicators (light tower) for process completion or process upsets
- RF Plasma Power: 40 kHz, 100 – 1000 W capacitive, downstream
- 0.1-1000 Torr Convection-type Pressure Sensor
- Aluminum Process Chamber
- Wafer platen temperature range from ambient to 250°C
- Wafer platen pulls out of chamber for easy product loading
- Parallel plate electrode
- Capacity: single wafer/pieces for 50mm - 200mm; Dual wafer/pieces for two 100mm (increased capacity for smaller wafers optional with special pin placement)
- Capable of processing wafer pieces on the wafer platen
- Vent gas inlet with turbulence control
- 4 Process Gas Inlets with needle valve flow rate control
- Process Chamber cooled by forced air convection
- System requires one pump assembly (sold separately)
- Strip rates up to 7000-8000 A/min at <10% uniformity. Dependent upon process temperature and gasses
- Class 10 clean room compatible
Measurements:
- Interior chamber dimensions: 10" W x 11.25" D x 1.96" H
- Overall system dimensions: 23.5" W x 43" D x 44.6" H
YES-1224 (Vapor Deposition System):
Chemical Delivery Assembly
- Two (2) chemical capacity. Withdraw directly from source bottles (chemical supplier's bottle)
- Ventilated cabinet with secondary containment
- Source material is kept at ambient temperature
- Source bottle cap and plumbing are N2 purged
- Two (2) micro pumps to allow precise metering of fluids
- Polyimide vacuum/vapor valve seals for increased process tempeartures, chemical resistance and less maintenance
- Two (2) independent vaporization micro flasks with independent chemical inlets
- Two (2) independent temperature controls for vapor deliviery line
- All source plumbing is PFA
Oven Assembly
- 316L Electro-polished stainless steel chamber
- Heated door with special design for heater coverage and insulation to improve uniformity and prevent condensation. Design will lower thermal transfer into the clean room
- Four (4) process trays can be configured in multiple positions to allow for different size substrates
- Four (4) independent temperature control zones for the process chamber to ensure uniformity
- Two (2) chemical vapor delivery (or water vapor) inlets, 3 plasma gas inputs, one additional process gas input
- Gas plumbing located on rear of chamber for ease of maintenance
- Preheated Nitrogen rapidly brings product to operational temperature
- System for accurate process pressure tracking through all vacuum ranges
- Rear-mounted, heated vacuum valve for ease of maintenance (prevents condensation at the valve). Independent controller can be set at any temperature between 0-205°C
- Vapor check
- Double door seal (Aflas) with Nitrogen purge zone
Controller Assembly
- Four (4) zone PID Chamber Temperature Control, 25-205°C with front panel readout
- PLC Controller with Touchscreen Operator's Interface
- Over-temp Protection Shut-Off
- EMO Buttons, (Front and Rear)
- Ethernet to monitor, upload & download programs
- Positive pressurized electronics chassis with failure interlock and visual confirmation
Measurements:
- Chamber Size: 16" W x 16" D x 18" H
- Overall System Dimensions: 40" W x 38" D x36" H
YES-G1000 (Plasma Cleaning System):
3 Mass Flow Controllers (MFCs) for gas mixing
Clean Room Capability: Class 10
N2 Flow Rate: 1.7 SCFM
Process Gas Flow Rate: 20-50 SCCM average
Chamber Material: 6061-T6 aluminum
Process Gas Inputs: 3 standard, 4th optional
SEMI® S2 Compliance
Number of Recipes: 12 with load/save/loop/link capability
RF Plasma Power: 0-1000 watts @ 550 VAC, selectable power
- Nitrogen Consumption: 0 SCFM idle, 1.7 SCF for average processes
- Reactant Gas Consumption: 0 SCFM idle, 150 SCC for average processes
Power Requirements: 208-230V, 20 amps, 50/60 Hz, 1 phase
State Logic Controlled System programmable through touch screen interface
Analog MFC control and monitoring (requires MFC options)
Removable electrodes conform to user requirements
Thermocouple monitoring for etch uniformity and protection of temperature sensitive substrates
Safety factors – integral RF and pressure interlocks
Emergency off switch
Ethernet Communications for Programming (data acquisition optional)
TCP/IP Port
Self-diagnostic program for easy troubleshooting.
Constant real-time display of System Status
Audible and Visual Cycle Complete Indicators.
Audible and Visual Indication of Incorrect Process with diagnostics display
0-1000 Torr Vacuum Sensor with 2 Programmable Trip Points.
Large load Capacity of up to 4 Active Plasma Areas of 15.13" W x 15.39" D inches (total of 931 sq. inches).
- Operational Modes: RIE, Active, Downstream Electron-free, Active Ion Trap, and Grounded Ion Trap
- Downstream mode produces charge-free plasma with near zero induced voltage
- KF 40 Vacuum Plumbing
- System Weight: 350 lbs. (159 kg.)
- Microprocessor Controlled Mass Flow Controllers - Set of three MFC's (one for each input gas) controlled from system keypad.
Measurements:
Interior Chamber Dimensions: 18" W x 18" D x 12" H
Chamber Process Area: 931 in2 or 233 in2 per shelf
Overall System Dimensions: 23.5" W x 28" D x 44.6" H
YES-3TA (Vacuum Bake/Vapor Prime)
- Microprocessor Control of output with input monitoring
- 120V AC instrumentation
- Programmable cycle complete light
- Programmable audible alarm
- 316 stainless steel chamber
- Internal chamber welds
- Two independent over-temperature safety switches
- Preheated N2 (Process Gas)
- 0.5 Micron N2 (Process Gas) filter
- Keylock to prevent unauthorized program entry
- Removable stainless steel shelf
- Side mounted HMDS flask
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