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Pre-owned

Yield Engineering Systems is now offering pre-owned and factory reconditioned YES tools!

Call 925-373-8353 or inquire within

Three (3) tools are currently for sale:

  • YES-CV200RFS (Plasma Photoresist/Descum System) Demo tool    {$49,500 - Domestic}
  • YES-1224 (Vapor Deposition System) Demo tool      {$125,000 - Domestic}
  • YES-G1000 (Plasma Cleaning System) Demo tool     {$39,500 - Domestic}
  • YES-3 (Vacuum Bake/ Vapor Prime System) {SOLD}

YES-CV200RFS (Plasma Photoresist/Descum System):

  • Tool Control: PLC control of valves, temperature set points, plasma generation power, auto operation, touch screen interface, self-diagnostic program for easy troubleshooting
  • Ethernet for PLC monitoring and software downloads
  • 12 Process Recipes with load/save/loop/link capability
  • Constant real-time display of System Status
  • Audible and Visual Indicators (light tower) for process completion or process upsets
  • RF Plasma Power: 40 kHz, 100 – 1000 W capacitive, downstream
  • 0.1-1000 Torr Convection-type Pressure Sensor
  • Aluminum Process Chamber
  • Wafer platen temperature range from ambient to 250°C
  • Wafer platen pulls out of chamber for easy product loading
  • Parallel plate electrode
  • Capacity: single wafer/pieces for 50mm - 200mm; Dual wafer/pieces for two 100mm (increased capacity for smaller wafers optional with special pin placement)
  • Capable of processing wafer pieces on the wafer platen
  • Vent gas inlet with turbulence control
  • 4 Process Gas Inlets with needle valve flow rate control
  • Process Chamber cooled by forced air convection
  • System requires one pump assembly (sold separately)
  • Strip rates up to 7000-8000 A/min at <10% uniformity. Dependent upon process temperature and gasses
  • Class 10 clean room compatible

Measurements:

  • Interior chamber dimensions: 10" W x 11.25" D x 1.96" H
  • Overall system dimensions: 23.5" W x 43" D x 44.6" H

YES-1224 (Vapor Deposition System):

Chemical Delivery Assembly

  • Two (2) chemical capacity.  Withdraw directly from source bottles (chemical supplier's bottle)
  • Ventilated cabinet with secondary containment
  • Source material is kept at ambient temperature
  • Source bottle cap and plumbing are N2 purged
  • Two (2) micro pumps to allow precise metering of fluids
  • Polyimide vacuum/vapor valve seals for increased process tempeartures, chemical resistance and less maintenance
  • Two (2) independent vaporization micro flasks with independent chemical inlets
  • Two (2) independent temperature controls for vapor deliviery line
  • All source plumbing is PFA

Oven Assembly

  • 316L Electro-polished stainless steel chamber
  • Heated door with special design for heater coverage and insulation to improve uniformity and prevent condensation.  Design will lower thermal transfer into the clean room
  • Four (4) process trays can be configured in multiple positions to allow for different size substrates
  • Four (4) independent temperature control zones for the process chamber to ensure uniformity
  • Two (2) chemical vapor delivery (or water vapor) inlets, 3 plasma gas inputs, one additional process gas input
  • Gas plumbing located on rear of chamber for ease of maintenance
  • Preheated Nitrogen rapidly brings product to operational temperature
  • System for accurate process pressure tracking through all vacuum ranges
  • Rear-mounted, heated vacuum valve for ease of maintenance (prevents condensation at the valve).  Independent controller can be set at any temperature between 0-205°C
  • Vapor check
  • Double door seal (Aflas) with Nitrogen purge zone

Controller Assembly

  • Four (4) zone PID Chamber Temperature Control, 25-205°C with front panel readout
  • PLC Controller with Touchscreen Operator's Interface
  • Over-temp Protection Shut-Off
  • EMO Buttons, (Front and Rear)
  • Ethernet to monitor, upload & download programs
  • Positive pressurized electronics chassis with failure interlock and visual confirmation
Measurements:
  • Chamber Size:  16" W x 16" D x 18" H
  • Overall System Dimensions: 40" W x 38" D x36" H

YES-G1000 (Plasma Cleaning System):

  • 3 Mass Flow Controllers (MFCs) for gas mixing
  • Clean Room Capability: Class 10
  • N2 Flow Rate: 1.7 SCFM
  • Process Gas Flow Rate: 20-50 SCCM average
  • Chamber Material: 6061-T6 aluminum
  • Process Gas Inputs: 3 standard, 4th optional          
  • SEMI® S2 Compliance
  • Number of Recipes: 12 with load/save/loop/link capability
  • RF Plasma Power: 0-1000 watts @ 550 VAC, selectable power
  • Nitrogen Consumption: 0 SCFM idle, 1.7 SCF for average processes
  • Reactant Gas Consumption: 0 SCFM idle, 150 SCC for average processes
  • Power Requirements: 208-230V, 20 amps, 50/60 Hz, 1 phase
  • State Logic Controlled System programmable through touch screen interface
  • Analog MFC control and monitoring (requires MFC options)
  • Removable electrodes conform to user requirements
  • Thermocouple monitoring for etch uniformity and protection of temperature sensitive substrates
  • Safety factors – integral RF and pressure interlocks
  • Emergency off switch
  • Ethernet Communications for Programming (data acquisition optional)
  • TCP/IP Port
  • Self-diagnostic program for easy troubleshooting.
  • Constant real-time display of System Status
  • Audible and Visual Cycle Complete Indicators.
  • Audible and Visual Indication of Incorrect Process with diagnostics display
  • 0-1000 Torr Vacuum Sensor with 2 Programmable Trip Points.
  • Large load Capacity of up to 4 Active Plasma Areas of 15.13" W x 15.39" D inches (total of 931 sq. inches). 
  • Operational Modes: RIE, Active, Downstream Electron-free, Active Ion Trap, and Grounded Ion Trap
  • Downstream mode produces charge-free plasma with near zero induced voltage
  • KF 40 Vacuum Plumbing
  • System Weight:  350 lbs. (159 kg.)
  • Microprocessor Controlled Mass Flow Controllers - Set of three MFC's (one for each input gas) controlled from system keypad.

Measurements:

  • Interior Chamber Dimensions: 18" W x 18" D x 12" H
  • Chamber Process Area: 931 in2 or 233 in2 per shelf
  • Overall System Dimensions: 23.5" W x 28" D x 44.6" H

YES-3TA (Vacuum Bake/Vapor Prime)

  • Microprocessor Control of output with input monitoring
  • 120V AC instrumentation
  • Programmable cycle complete light
  • Programmable audible alarm
  • 316 stainless steel chamber
  • Internal chamber welds
  • Two independent over-temperature safety switches
  • Preheated N2 (Process Gas)
  • 0.5 Micron N2 (Process Gas) filter
  • Keylock to prevent unauthorized program entry
  • Removable stainless steel shelf
  • Side mounted HMDS flask


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