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Contract Services

YES provides complimentary demonstrations for customers evaluating systems and contracted services for it's entire product line!

We can handle your customized chemicals and for standard processes we do not need proprietary information.  For more unique conditions, please contact us.  We can handle many types of substrate materials.

Submit your request online or call Lori Cantrell at
1-888-YES-3637 or 925-373-8353.

Chemical Vapor Deposition (CVD) Applications:
CVD enables nano-precise control and run-to-run repeatability of processes. Whether you need an inert surface coating for MEMS or a reactive surface for semiconductor or microarray precessing, CVD is especially suited for achieving uniform results.  Commonly used chemicals for this application include:

Adhesion Promotion Coatings

• APTES – (Aminopropyltriethoxysilane), APTMS – (Aminopropyltrimethoxysilane)
• 3-GOPS ((3-Glycidoxypropyl)trimethoxysilane), GPTMS
• (3-Acryloxypropyl)trimethoxysilane
• MAPTMS - A-174, Dow 6030, Methacryloxypropyltrimethoxysilane
• OTCS – (Octyltrichlorosilane) – AP for IndiumTin Oxide Films
• HMDS - Hexamethyldisilazane

We handle many other types of substrate materials.  For more unique conditions, please contact us.

Anti-Stiction Coatings

• FDTS – (Fluorodecyltrichlorosilane, (Heptadecafluoro-1,1,2,2-tetrahydrodecyl)trichlorosilane, perfluorodecyltrichlorosilane, (Heptadecafluoro-1,1,2,2-tetrahydrodecyl)trimethoxysilane
• FOTS – (fluorooctyltrichlorosilane, (Tridecafluoro-1,1,2,2-tetrahydrooctyl)trichlorosilane, perfluorooctyltrichlorosilane, (Tridecafluoro-1,1,2,2-tetrahydrooctyl)trimethoxysilane

For other chemistries. please contact YES to discuss your needs.

Plasma Strip Applications:
Layers of photoresist are removed in a powerful oxygen plasma stripping process.  For thicker layers of resist or polyimide, an oxygen/CF4 plasma is recommended for effective cleaning.  

Plasma Cleaning Applications:
Our plasma cleaning systems are an effective way to remove small amounts of contaminants from a substrate surface without using hazardous solvents. Allows surface modification and preparation for bonding.

Image Reversal Applications:
Our image reversal systems make it possible to achieve precisely defined vertical sidewall profiles. The process reverses the action of positive resist so negative images can be formed with overhanging profiles for metal liftoff processing.

Vacuum Bake/Vapor Prime Applications:
YES developed a process combining heat with low pressure. Wafers are dehydrated of surface moisture, as well as, chemically bound water molecules and then primed with an HMDS vapor to strengthen photoresist adhesion.

High Temperature Vacuum Cure Applications:
Designed to give total parameter control for curing of polyimide, BCB and Low-k dielectric films as well as copper anneal in a clean environment. Wafers placed in a YES high temperature vacuum oven stay clean.

Your Information Is Safe With YES!
A non-disclosure agreement can be in place, if necessary.

Pricing and Terms

• Please contact YES for pricing and lead times.
• Typical lead time is 1-2 weeks.
• Inquire about 1-day turnarounds!