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A stamped or etched metal frame, usually connected to the bonding pads of a die by wire bonding, which provides external electrical connections for a packaged electrical device.
Lithography
The transfer of a pattern or image from one medium to another, such as from a mask to a wafer. If light is used to effect the transfer, then the term is “photolithography,” and “microlithography” is used to refer to the process when applied to images with features in the micrometer range.
Low Pressure CVD (LPCVD)
Chemical Vapor Deposition (CVD) processes at subatmospheric pressures. Reduced pressures often reduce unwanted gas phase reactions and improve film uniformity across the wafer. Most CVD process are either LPCVD or UHVCVD.
LSI
Large Scale Integration. The process of putting tens of thousands of transistors into a single IC.
Lubricant
A material that reduces friction and wear; a material that, when applied to the tool/work piece interface, promotes the flow or removal of metal; a material that aids in the release of finished parts.
Lubricity
The ability of a lubricant to reduce wear and friction, other than by its purely viscous properties.