Glossary

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Term	Definition
Acid	A chemical substance that yields hydrogen ions when dissolved in water (lowers the pH).
Additive	A material added to a lubricant for in order to impart new properties or enhancing existing properties.
Adhesion	There are five types of adhesion: Chemical Adhesion - two materials may form a compound at the join. The strongest joins are where atoms of the two materials swap (ionic bonding) or share (covalent bonding) outer electrons. A weaker bond is formed if oxygen, nitrogen, or fluorine atoms of the two materials share a hydrogen nucleus (hydrogen bonding). Dispersive Adhesion, or Adsorption - two materials may be held together by van der Waals forces, or the attraction between two molecules that have positively and negatively charged ends. Electrostatic Adhesion - some conducting materials may pass electrons to form a difference in electrical charge at the join. Diffusive Adhesion - may occur when molecules of both materials are mobile an soluble in each other. Particularly effective with polymer chains where one end of the molecule diffuses into the other material. Mechanical Adhesion - two materials may be mechanically interlocked.
Adsorption	Adhesion of molecules of gases, liquids, or dissolved substances to the surface of a solid or liquid, forming a molecular or atomic film. In biomed applications, this undesired affect is also called "fouling." It is different from absorption, where a substance diffuses into a liquid or solid to form a "solution."
Aerosol Assisted CVD (AACVD)	Aerosol assisted chemical vapor deposition. A CVD process in which precursors are transported to the substrate by means of a liquid/gas aerosol, which can be generated ultrasonically. This technique is suitable for use with involatile precursors.
Alkaline Cleaner	A material blended from alkali hydroxides and such alkaline salts as borates, carbonates, phosphates, or silicates.
Alkaline Reserve	A measure of acid required in order to neutralize the same weight of alkaline salt. Higher alkaline reserve can indicate a more stable product with better rust protection.
Alkalinity	The concentration of basic or alkaline components in a mixture determined by titration with an acid.
Alloy Steel	Multi-component alloys of iron, silicon, carbon, chromium, manganese, nickel, sulfur, phosphorus, and lead. Other elements are sometimes, albeit infrequently, used to achieve unusual metallurgical or machinability properties.
Amines	Organic compounds which are a type of functional group that contain nitrogen as the key atom.
Angstrom	One ten-billionth of a meter. Some chip layers are only 100 angstroms thick.
Anneal	Annealing is a heat treatment where the microstructure of a material is altered, causing changes in its properties such as strength and hardness. In the semiconductor industry, silicon wafers are annealed so that dopant atoms (such as boron, phosphorus, or arsenic), can be incorporated into substitutional positions in the crystal lattice, resulting in drastic changes in the electrical properties of the semiconducting material.
Ash	The residue left after combustion of an oil sample.
Assembly	A step in the semiconductor manufacturing in which the chip (die) is encased in either a plastic, ceramic or other package, or assembled directly on a printed circuit board.
Atmospheric Pressure CVD (APCVD)	Atmospheric pressure chemical vapor deposition (CVD). CVD processes at atmospheric pressure.
Atomic Layer CVD (ALCVD)	Atomic layer chemical vapor deposition, also known as Atomic Layer Epitaxy or Atomic Layer Deposition (ALD). A chemical vapor deposition process in which two complementary precursors are alternately introduced into the reaction chamber. Typically, one of the precursors will adsorb onto the substrate surface, but can’t decompose without the second precursor. The precursor adsorbs until it saturates the surface. Further growth can’t occur until the second precursor is introduced, which means film thickness is regulated by the number of precursor cycles instead of the deposition time as in conventional CVD. In theory, ALCVD allows for highly precise control of film thickness and uniformity.