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Semiconductor Batch Wafer Cure Oven

YES-PBV300

Overview
YES-PBV300 Specs (300mm)
Process Management Software (option)

The YES-PBV300 automated high temperature cure oven is designed for today's most demanding process applications. YES-PBV300 helps you achieve total environmental control so you increase your yields and extend device performance. The system incorporates the laminar flow technology of the YES-450PB Series, but offers optional silane vapor deposition.

Standard Applications:

• Polyimide cure
• Copper anneal
• BCB cure
• Low-k dielectric cure

With Silane Vapor Deposition Option:

• Porous dielectric repair
• Copper to low-k adhesion layer
• Copper anti-oxidation barrier
• Copper oxide removal
• Copper diffusion barrier
• Moisture removal/film sealing
• Imprint lithography surface adhesion control
• Hydrophobic sealing
• Electro-migration TTF modification

Ideal Process Environment

YES-PBV300 is designed to achieve tight control over your process atmosphere:

• Maximum process temperature up to 450ºC
• Controlled ramp up and cool down
• Extremely low oxygen process concentrations
• Low--or no--particle addition
• Fully automated
• Touch screen interface
• Silane vapor deposition option reduces steps to keep your process clean
• In-situ plasma option for chamber cleaning between processes
• Horizontal laminar flow for increased particle isolation and removal (for most cure processes, average particle addition is negative)

Temperature Uniformity

YES-PBV300 dwell temperature uniformity is ±3°C. This includes our patented laminar flow of preheated nitrogen, as well as door thermal baffles to reduce load front-end temperature drop during both dwell and ramp. Cooling air distribution is adjustable, providing ramping temperature control over the operating range of 50 - 450°C. YES-PBV300 uses three heater zones with temperature control thermocouples embedded among process wafers.

Cleanliness

YES-PBV300 gently carries away particles using YES patented laminar flow process; in most cases, your process will have a particle reduction. Dry filtered nitrogen enters the system through a .003-micron inline filter; gas is preheated prior to entering the gas plenum in the system chamber. Vacuum suction from the vacuum plenum creates the nitrogen laminar flow that removes particles.

Chamber Design

Chamber construction is welded 316L stainless steel with seal flange and cylindrical process chamber. The chamber flange has two o-rings with a purgeable zone between them. A continuous nitrogen flow during your process eliminates oxygen leakage through the door seal.

Chamber Cooling

The chamber is cooled by continuous, adjustable forced air convection. This prevents o-ring door seals from overheating and provides superior low temperature control stability and ramp tracking. Ambient air-mixing ratio is variable for maximum cooling performance over the entire operating temperature range.

Exhaust from cooling the chamber/cabinet flows through the base of the tool, making it ideal for installation in vertical laminar flow clean rooms with a perforated floor, or through a duct connection on the rear of the system.

Chamber cooling exhaust is heated, and the maximum exhaust temperature can be adjusted to meet specific site requirements. Since lower exhaust temperature limits may affect process-cooling performance, YES recommends an exhaust temperature limit of 50-60°C.

Process Cycle

The YES-PBV300 cure process runs long durations with a continuous flow of process gas to enhance solvent evaporation and improve particle isolation of the product wafers. The system is alternately evacuated and returned close to atmospheric pressure with pre-heated nitrogen. This process removes oxygen, moisture, and solvent vapors from the chamber interior. YES-PBV300 routinely achieves O₂ concentration <10 ppm. In a typical process, the system is then held for a preset "dwell" period at a fixed temperature, with a bleed of preheated nitrogen to continue the purge (and particle removal) process.

Subsequent temperature ramp and dwell cycles are normally carried out with a continuous purge of pre-heated nitrogen until the end of the last dwell period. The system is then brought to a pre-selected temperature by circulating room temperature nitrogen prior to product unload and reload. During the process, circulating air continuously cools the oven door and seal assemblies to maintain surface temperatures below 150°C, even when the chamber is operating at 450°C.

Standard Process Features:

• Controlled gas composition
• Nitrogen purged dual o-ring door seal assembly eliminates oxygen leakage into chamber
• One process gas
• <0.5 micron filtering on all process gases
• All-welded construction process gas piping with VCR® fittings
• Accelerated cooling rates with variable speed
• Forced convection cooling of the exterior of vacuum chamber
• Chamber cooling air mixed with ambient air reduces exhaust temperature below safe limits
• Adjustable ambient air mixing ratio allows maximum cooling performance over entire operating temperature range

Standard Applications

• Alpha particle barriers
• Passivation and protection layers
• Micro solder stop masks
• Interlayer dielectrics
• Metal lift-off masks
• Ion etch masks
• Ion implantation masks

BCB Bake:

Similar to a polyimide cure process, but at lower temperatures. Cooling package allows faster process time.

Copper Anneal:

The cool down package makes the YES-PBV300 ideal for this lower temperature process, which is very sensitive to oxygen. YES recommends using a forming gas and O₂ analyzer.

Low-K Dielectric Cure:

YES-PBV300 achieves complete dehydration on porous low-k materials through the combination of heat and nitrogen purges.

Additional Applications

With Silane Vapor Deposition Option:

• Porous dielectric repair
• Copper to low-k adhesion layer
• Copper diffusion barrier
• Copper anti-oxidation barrier
• Copper oxide removal
• Moisture removal/film sealing
• Imprint lithography surface adhesion control
• Hydrophobic sealing
• Electro-migration TTF modification
  

User Friendly Interface

YES-PBV300 user interface is implemented on a touch screen PC. The user interface provides:

• System status display
• Host communications status display
• Alarm status and alarm history
• Direct operation of system, robotic, and oven I/O in maintenance mode
• Process recipe editing and storage
• Display of carrier ID