Benzocyclobutene (BCB) is used to create photosensitive polymers, which require fewer processing steps than dry etch materials. BCB-based polymer dielectrics may be spun on or applied to a variety of substrates for use in MicroElectro-Mechanical Systems (MEMS) and microelectronics processing.
BCB’s primary advantage over other polymers is its compatibility with conventional integrated circuit (IC) processing techniques as well as with various metallization systems. BCB also has a low-K dielectric, a low dissipation factor at high frequencies, low moisture absorption, and a high degree of planarization.
YES-450PB ovens and the fully automated YES-VertaCure are ideally suited for this process.