Wirebond Preparation

Wirebond PreparationAfter hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy. But this process causes small amounts of contamination on top of the bond pads that can inhibit wire bonding. Therefore, treating the surface to remove contaminants improves the wire bond.

YES plasma cleaning systems such as the YES-G500 & G1000 are ideally suited for wire bond surface preparation.

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News & Updates

  • September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
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  • August 9, 2016 - YES Featured in Two Trade Magazines
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  • April 26, 2016 - YES Exhibiting at Two Upcoming Tradeshows
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  • January 22, 2016 - YES Receives Multi-Million Dollar Orders for a Dynamic Project in Taiwan
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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.

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