In wafer fabrication, photoresist is used to transfer a circuit pattern onto the wafer.
Removing residues (scum) from a substrate through gentle plasma cleaning is known as descumming.
Oxygen plasma etching is an effective treatment for “burning off”, or bombarding, organic residues left on wafer surfaces due to resist cross-linking or polymerization.
After hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy.
The use of plasma is an effective way to clean without using hazardous solvents. Plasma is an ionized gas capable of conducting electricity and absorbing energy from an electrical supply.
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