Wednesday, April 23, 2014
Request Quote

Photoresist Treatment

Applications:

Vacuum Bake/Vapor Prime Systems + Image Reversal

Resist Adhesion

YES introduced a process now commonly known in the semiconductor industry as vacuum bake/vapor prime, a key step in the front end processing of silicon chips.

Resist Adhesion

 

 

Rev Process

Image Reversal

This process reverses the action of positive resist so negative images can be formed with the same resolution and processing ease that a positive resist allows. What’s more, image reversal allows variations of the slope of the photoresist sidewall for higher resolution and/or lift off profiles.

Image Reversal

 

Vacuum Bake/Vapor Prime Systems + Image Reversal

Silylation

In the silylation process, HMDS reacts with the oxide surface and forms a strong bond to the surface. At the same time, free bonds are left which readily react with the photoresist, enhancing adhesion.

Silylation

 

 Please call 1-925-373-8353 or 1-888-YES-3637 (US toll free). Or you can submit an inquiry online, contact us.

Home   |   About Us   |   Products   |   Applications   |   WLP   |   MEMS   |   News   |   Contact Us
©2014 Copyright Yield Engineering Systems, Inc. | All Rights Reserved