Vapor Deposition is a process widely used in the semiconductor and biotechnology industries for the deposition of a thin film of various materials.
When copper is annealed some of its molecules want to diffuse into the dielectric; unfortunately, this diffusion reduces the insulation and degrades mechanical and thermal properties.
For MEMS device packaging, a hydrophobic coating reduces stiction, the undesired static friction that wears down devices.
Consists of modifying surfaces to encourage bonding between unlike materials.
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