Yield Engineering Systems, Inc. 203-A Lawrence Drive (map) Livermore, CA 94551-5152 USA
Phone (USA): 888-937-3637 Worldwide: 925-373-8353
Vapor Deposition is a process widely used in the semiconductor and biotechnology industries for the deposition of a thin film of various materials.
When copper is annealed some of its molecules want to diffuse into the dielectric; unfortunately, this diffusion reduces the insulation and degrades mechanical and thermal properties.
For MEMS device packaging, a hydrophobic coating reduces stiction, the undesired static friction that wears down devices.
Consists of modifying surfaces to encourage bonding between unlike materials.
Please call 1-925-373-8353 or 1-888-YES-3637 (US toll free). Or you can submit an inquiry online, contact us.