Throughout the history of the semiconductor industry, devices have become more and more complex. However, with each additional layer in a device, there is a common need to apply, image and finally remove a pattern in a layer of photoresist. Today, devices may have upwards of 50 masking steps. Plasma processing has become the standard for clean gentle removal of photoresist layers. Yield Engineering Systems, Inc. (YES) designed the YES-ÉcoClean to be a production system that is cost-effective, fast and reliable.
The YES-ÉcoClean system is a downstream resist stripper; the remote source generates atomic oxygen which chemically reacts with the photoresist of the wafer surface. This process is well known for high strip rate with little or no electrical damage to the substrates and devices.
The inductively-coupled plasma source produces a high-density plasma that creates reactive species which flow out of the plasma chamber and down to the wafer vacuum chamber. One of the features of a remote plasma source is that charged plasma species are confined within the plasma chamber and only charge-neutral species flow from the source and interact with the substrate. Data collected from the YES-ÉcoClean shows little or no change in electrical characteristics on the monitors used in the tests.
The YES-ÉcoClean includes 2 standard Mass Flow Controllers (3rd forming gas MFC-optional), and a 3000 watt power source. The heated wafer chuck can be operated from 75º to 300ºC.
The single arm 7.25” Z travel robot is a surface mount design, capable of handling 50-200mm substrates. Multiple end effectors are available for various substrates and materials.