Designed for reliability and flexibility, the YES-ÉcoClean system is a small footprint, single cassette, single chamber with accurate Z travel robot for precise wafer handling. This low cost system provides excellent ash rates with good uniformity.
The YES-ÉcoClean system is a downstream asher, where atomic oxygen is generated with the design of the plasma source and process chamber. Downstream ashing, is well known for high ash rate with little or no electrical damage to the substrates and devices.
The atomic oxygen chemistry not only provides high ash rate, but infinite selectivity’s to the underlying material. CHARM-2 data has been collected, and the results show little or no change in electrical characteristics on the monitors used in the tests.
The YES-ÉcoClean includes 2 standard Mass Flow Controllers (3rd forming gas MFC-optional), and a 3000 watt power source. The heated wafer chuck can be operated from 75º to 300ºC.
The single arm 7.25” Z travel robot is a surface mount design, capable of handling 50-200mm substrates. Multiple end effectors are available for various substrates and materials.