Fortrend & YES partnered to develop an automated 4 FOUP, 300/200mm Oven.
Fortrend’s Equipment Front End Module (EFEM) coordinates the transport of wafers to YES’ back-end oven which provides thermal curing with accurate temperature control.
The system can accommodate a variety of processes needed to successfully cure a variety of materials, such as:
The oven is ideal for your Fan-Out Wafer Level Packaging needs. Read more about FOWLP here.