Fortrend & YES partnered to develop an automated 4 FOUP, 300/200mm Oven.

Fortrend’s Equipment Front End Module (EFEM) coordinates the transport of wafers to YES’ back-end oven which provides thermal curing with accurate temperature control.

The system can accommodate a variety of processes needed to successfully cure a variety of materials, such as:

  • Polyimides
  • PBO (Polybenzoxazoles)
  • BCB (Benzocyclobutene – Cyclotene)
  • Epoxy “hybrids”

System Benefits

  • Excellent electrical and thermal performance
  • Excellent high temperature warpage performance
  • Improved board-level reliability
  • Reduction in the number of particles
  • Shorter process time
  • Less Nitrogen used
  • No discoloration
  • No trapped solvent
  • Increase in Known Good Die
  • Excellent temperature uniformity
  • Fast ROI

The oven is ideal for your Fan-Out Wafer Level Packaging needs.  Read more about FOWLP here.

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News & Updates

  • October 23, 2017 - YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP.
    Read more »
  • June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
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  • May 5, 2017 - YES CEO to Participate as a Panelist
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  • January 20, 2017 - YES Highlighted in Online Commentary
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  • September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
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  • August 9, 2016 - YES Featured in Two Trade Magazines
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Other Updates

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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.