Applications:

BCB Cure

Benzocyclobutene (BCB) is used to create photosensitive polymers, which require fewer processing steps than dry etch materials.

BCB Cure

Copper Anneal

Annealing is a heat treatment where the microstructure of a material is altered, causing changes in its properties such as strength and hardness.

Copper Anneal

Dehydration Bake

Vacuum bake at high temperature to ensure elimination of surface moisture.

Dehydration Bake

Fan Out Wafer Level Packaging

Fan-out wafer level packaging (FOWLP) uses mold compound to embed various functional dies.

Fan Out Wafer Level Packaging

Low-k Dielectric

Complete dehydration of porous low-K material poses a major challenge to process engineers.

Low-k Dielectric

Polyimide Cure

Polyimides are high temperature engineering polymers utilized by semiconductor manufacturers for their excellent mechanical, thermal, and electrical properties.

Polyimide Cure

Please call 1-925-373-8353 or 1-888-YES-3637 (US toll free). Or you can submit an inquiry online, contact us.

• October 23, 2017 - YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP.
  Read more »
• June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
  Read more »
• May 5, 2017 - YES CEO to Participate as a Panelist
  Read more »
• January 20, 2017 - YES Highlighted in Online Commentary
  Read more »
• September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
  Read more »
• August 9, 2016 - YES Featured in Two Trade Magazines
  Read more »

Other Updates

• See our list of upcoming tradeshows!