Polyimide Cure/Bake/Anneal

Applications:

Vacuum Bake/Vapor Prime Systems + Image Reversal

BCB Cure

Benzocyclobutene (BCB) is used to create photosensitive polymers, which require fewer processing steps than dry etch materials.

BCB Cure


Copper Anneal

Annealing is a heat treatment where the microstructure of a material is altered, causing changes in its properties such as strength and hardness.

Copper Anneal


Vacuum Bake/Vapor Prime Systems + Image Reversal

Dehydration Bake

Vacuum bake at high temperature to ensure elimination of surface moisture.

Dehydration Bake


Fan Out Wafer Level Packaging

Fan Out Wafer Level Packaging

Fan-out wafer level packaging (FOWLP) uses mold compound to embed various functional dies.

Fan Out Wafer Level Packaging


Vacuum Bake/Vapor Prime Systems + Image Reversal

Low-k Dielectric

Complete dehydration of porous low-K material poses a major challenge to process engineers.

Low-k Dielectric


Rev Process

Polyimide Cure

Polyimides are high temperature engineering polymers utilized by semiconductor manufacturers for their excellent mechanical, thermal, and electrical properties.

Polyimide Cure

Please call 1-925-373-8353 or 1-888-YES-3637 (US toll free). Or you can submit an inquiry online, contact us.

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News & Updates

  • October 23, 2017 - YES is exhibiting at two upcoming trade shows promoting the benefits of dielectric vacuum cure ovens in FOWLP.
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  • June 30, 2017 - YES Will Be an Exhibitor and Sponsor at Microelectronics Tradeshow
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  • May 5, 2017 - YES CEO to Participate as a Panelist
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  • January 20, 2017 - YES Highlighted in Online Commentary
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  • September 23, 2016 - YES Exhibiting at Two Upcoming Tradeshows
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  • August 9, 2016 - YES Featured in Two Trade Magazines
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Other Updates

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About Our Company

Located in Livermore, California, Yield Engineering Systems (YES) is a privately held company that manufactures engineering process control equipment to meet the needs of innovative engineers and lab managers.

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