PRODUCTS
CLEAN
Clean

RESIST STRIP

In wafer fabrication, photoresist is used to transfer a circuit pattern onto the wafer.

Resist Strip


RESIST DESCUM

Removing residues (scum) from a substrate through gentle plasma cleaning is known as descumming.

Resist Descum


ORGANICS REMOVAL

Oxygen plasma etching is an effective treatment for “burning off”, or bombarding, organic residues left on wafer surfaces due to resist cross-linking or polymerization.

Organics Removal


WIREBOND PREPARATION

After hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy.

Wirebond Preparation


PLASMA CLEANING

The use of plasma is an effective way to clean without using hazardous solvents. Plasma is an ionized gas capable of conducting electricity and absorbing energy from an electrical supply.

Plasma Cleaning


Please call 1-925-373-8353 or 1-888-YES-3637 (US toll free). Or you can submit an inquiry online, contact us.